Attending PCIM Europe 2024

Attending PCIM Europe 2024, a renowned global expo and conference for power electronics, offered an unparalleled glimpse into the industry’s latest innovations, trends, and advancements.

Industry giants and innovators such as Infineon Technologies, Efficient Power Conversion (EPC) Corporation, Fuji Electric Europe, Mitsubishi Electric Europe, Onsemi, SEMIKRON Danfoss, ROHM Semiconductor, STMicroelectronics, Volkswagen, Wolfspeed, Texas Instruments, Navitas Semiconductor, Power Integrations, Nexperia, Cambridge GaN Devices (CGD), Innoscience, Wurth Electronics, Recom Power, TDK, Littelfuse, Toshiba, Wise Integrations to name a few were in attendance, alongside many new exhibitors across countries including China, Germany, Taiwan, and the USA.

The conference featured a diverse program of talks by esteemed speakers, offering valuable insights into recent research and fostering essential industry connections. Some of the key common words and phrases across most discussions, presentations and meetings were: Power in Electronics, wide-band-gap, GaN, SiC, Bi-directional, Half-bridge, Vertical GaN, GaN&Sic Hybrid, high power, power switching, power density, efficiency, sustainability, datacentres, AI, fast computing, kWs of power, EV fast charging solutions, use of GaN beyond consumer (mobile) devices, new partnerships, next expected M&A news and others.

Highlights of Day 1: June 11, 2024

The first day at PCIM Europe 2024 started with a flurry of activities and innovations particularly focusing on wide-bandgap power devices. The day began with an engaging keynote session that set the tone for the event. Rolf Hellinger from Siemens opened the session by discussing the practical applications of artificial intelligence in the power electronics lifecycle, moving beyond the hype to showcase real-world industrial uses.

Wide-bandgap semiconductors, especially Gallium Nitride (GaN) and Silicon Carbide (SiC) devices, were at the forefront of the innovations presented. Cambridge GaN Devices (CGD) introduced its new P2 line of 650-V ICeGaN devices designed for higher-power applications. Onsemi showcased its integrated GaN solution with a silicon gate driver.

Texas Instruments announced DRV7308 for HVAC systems which attained more than 99% efficiency and 50% reduced power losses. DRV7308 is a GaN IPM (Intelligent Power Module), which has optimized acoustic performance, reduced solution size and lower system costs, and its flabbergasting inverter efficiency.

On the SiC front, Microchip presented its SiC-based onboard charger system solution, demonstrating significant advancements in charging technology. Wolfspeed discussed the innovative use of SiC in air taxis and mining trucks, showcasing the versatility and robustness of SiC in demanding applications.

Navitas Semiconductor displayed its SiC MOSFETs portfolio (announced before this event) consisting of Gen-3 Fast (G3F) 650 V and 1200 V SiC MOSFETs. This new product line allows the next-generation AI PSUs’ wattage to increase to 10 kW and the power per rack to increase from 30 kW to 100-120 kW. Navitas Semiconductor also displayed its recently announced (March 2024) GaN&SiC hybrid 4.5kW AI-powered power supplies for servers. This innovative product mitigating power challenges in datacenters was announced earlier this March.

In addition to product showcases, the day featured insightful technical sessions and poster presentations. These sessions covered a range of topics, including e-mobility and Advanced Packaging Technologies, providing attendees with deep dives into the latest research and development trends.

Highlights of Day 2: June 12, 2024

The spotlight on wide-bandgap semiconductors continued from Day 1, with Cambridge GaN Devices, Onsemi, and Texas Instruments leading the way. Martin Wietschel from the Fraunhofer Institute ISI, the keynote speaker of the second day, provided a detailed analysis of the electrification of heavy goods transport within Germany and the EU, highlighting the essential requirements and challenges.

Onsemi presented an integrated GaN solution featuring a silicon gate driver. It also unveiled the new Onsemi 7th generation 1200V QDual3 IGBT power modules significantly boost power density and efficiency, offering up to 10% more output power and reducing energy losses by 200W in 150KW inverters.

ONsemi was also part of a major panel discussion on ‘SiC Wide Bandgap Design, The Future of Power‘ led by Bodo’s Power Systems. This two-part panel discussion in particular caught my interest which had experts from Cambridge GaN Devices, Navitas Semiconductor, Nexperia, Transphorm, Efficient Power Conversion (EPC), Infineon, Texas Instruments, and Power Integrations, discussing the future of WBG semiconductors and ‘the future of power’.

Silicon Carbide Innovations

Silicon carbide (SiC) technology was another key focus. Microchip highlighted its SiC-based onboard charger system solution, emphasizing its comprehensive nature, including PFC gate drivers and firmware for efficient management.

Wolfspeed presented the use of SiC in innovative applications such as air taxis and mining trucks, demonstrating the versatile potential of SiC in high-power, high-reliability environments.

Top-side Cooling Packages were in the limelight

Packaging solutions received significant attention, with Heraeus discussing high-reliability sintering solutions for robust applications.

Infineon showcased its Top Cool package solutions for silicon carbide, which enhance thermal performance and extend device longevity.

Cambridge GaN Devices (CGD) also showcased packages with both top-side and dual-side cooling. Wolfspeed’s 13 kW SiC-based reference design for automotive HVAC systems also included top-side cooling, with Lauren Kegley highlighting its benefits for PCB density, high-volume manufacturing, and improved thermal performance. This emphasis on packaging underscores the critical role it plays in maximizing the performance and reliability of WBG devices.

New Product Demos and Innovations

Several notable product demonstrations took place, including EPC’s half-bridge GaN FET for 100V motor drive applications and Wolfspeed’s 25 kW base splitless module for bidirectional low-medium power applications. These demos highlighted the advancements in power density and efficiency achievable with the latest semiconductor technologies.

Industry Collaboration and Technological Advances

Industry collaboration was evident with companies like Tektronix and Power Integrations showcasing their latest products. Tektronix demonstrated new high-power DC power supplies and oscilloscopes, while Power Integrations introduced updates to its BridgeSwitch simulation tool, enhancing design accuracy and reducing standby power consumption.

Emerging Applications and Market Trends

Emerging applications for GaN and SiC technologies were a recurring theme. Navitas Semiconductor discussed a 600W microinverter for solar applications, while other discussions centred on high-power applications in AI servers and industrial automation.

The automotive sector also saw significant interest, with companies like Infineon and Apex highlighting the potential of SiC modules in electric vehicles and industrial applications.

Highlights of Day 3: 13th June 2024

The discussions on Day 3 underscored the industry’s ongoing commitment to improving reliability and quality in power applications. The integration of advanced protection circuits with GaN devices and the development of robust packaging solutions for SiC components were key themes that resonated throughout the day.

The final day keynote speech was presented by Gerald Deboy from Infineon Technologies who addressed the evolving demands for powering the latest processor generations in hyper-scale datacenters.

The event also provided a platform for industry leaders to share their insights on emerging trends and future directions in power electronics. Topics such as battery analysis, electrification, renewable energy, and climate change were explored, reflecting the broader impact of technological advancements in the field.

Panel Discussion on Quality and Failure Testing

A highlight of the day was the panel discussion moderated by Maurizio Di Paolo Emilio, editor-in-chief of Power Electronics News. The panel focused on quality and failure testing in power applications, featuring prominent industry experts:

• Alex Lidow from EPC
• Thierry Bouchet from Wise Integration
• Timothy Han from SemiQ
• Kevin Speer from Microchip Technology

The discussion stressed the critical importance of integration to enhance reliability, particularly with protection circuits for GaN devices. The experts emphasized that integrating GaN devices with protection and sensing circuits can prevent operational failures and enhance the overall reliability of power systems.

Maurizio and the panellists delved into various aspects of reliability, including:

• Testing and Failure Analysis: Understanding the physics of device failures and the necessity of rigorous testing to identify potential weaknesses in billions of devices.
• Application-Specific Requirements: Addressing different reliability and quality requirements across various applications such as solar energy, automotive systems, and other industrial setups.
• Integration for Enhanced Protection: Highlighting the push towards integrating GaN devices with protection circuits to ensure they operate safely and reliably under different conditions.

Key Highlights and Innovations

Throughout the final day, several companies showcased their latest innovations and contributions to the power electronics field:

• EPC presented a demo of their half-bridge GaN FET for 100V motor drive applications.
• Wolfspeed demonstrated their 25 kW base splitless module for bidirectional power applications.
• Heraeus discussed high-reliability sintering solutions, emphasizing the importance of robust packaging for wide-band-gap devices.
• Infineon Technologies highlighted their Top Cool package solutions for silicon carbide, designed to enhance thermal performance and device longevity.

Attending Computex 2024

WAWT was also remotely keeping a close watch on the activities at another key industry event Computex 2024, a renowned global exhibition focusing on “Connecting AI”. With 1,500 companies from 36 countries utilizing 4,500 booths, it showcased major advancements in AI computing, 5G, smart cars, and other innovations.

The opening keynote by AMD CEO, Dr. Lisa Su titled ‘The future of high-performance computing in the AI Era’, aid the canvas of the overlying theme of the exhibition.

Nvidia CEO Jensen Huang in his 2 hours keynote session spoke of two major ‘tectonic shifts in computing’ introducing some key progress made with Nvidia’s digital twin of the earth: EARTH 2.0. Huang also emphasized the need for accelerated computing for everything. “Accelerate everything,” he said. “It makes no sense to use general purpose computing today.” He added that accelerated computing can reduce power consumption by 90%.

Qualcomm and Intel also had major keynote addresses, and unsurprisingly the AI PC theme that we’ve seen throughout 2024 has also been a big theme at Computex 2024. Following are some noteworthy announcements, I would like to highlight:

• Nvidia’s new guidelines for small form factor (SFF) PCs were another highlight, simplifying the building process by listing compatible GPUs and cases, ensuring component compatibility without establishing a new standard.
• AMD stole the spotlight with its new Zen 5 CPUs, including the Ryzen 9000 desktop processors and Ryzen AI 300 mobile processors. These processors promise a significant performance increase, boasting up to a 55% improvement over Intel’s Core i9-14900K. The Ryzen AI 300 chips are particularly noteworthy for their fast Neural Processing Unit (NPU), capable of 50 Tera Operations Per Second, designed for Microsoft’s Copilot+ PCs.
• Intel made waves with its Lunar Lake CPUs, designed exclusively for laptops and set to launch between July and September 2024. Featuring a “radical low-power architecture,” Lunar Lake is the first Intel chip to be manufactured by TSMC focusing on efficient (E) cores, with a redesigned GPU promising a 50% performance boost.
• Asus introduced the ROG Azoth Extreme, an upgraded version of its renowned gaming keyboard. This 75% keyboard includes a full-colour OLED touchscreen display, wireless support with an 8,000Hz polling rate, and an adjustable gasket for a customisable typing feel, making enthusiast-level features more accessible.
• Acer unveiled the Predator X27U F3, a 1440p OLED gaming monitor with a remarkable 480Hz refresh rate, priced at $1,600, and set to launch between July and September.

Summary

Attending PCIM Europe 2024 and closely monitoring COMPUTEX 2024 provided insights into the latest advancements in power electronics and AI technologies.

PCIM Europe 2024 featured innovations in wide-bandgap semiconductors like GaN and SiC, with keynotes and product launches from major companies such as Siemens, Texas Instruments, and Onsemi. The event emphasized reliability, quality, and integration in power applications.

Meanwhile, COMPUTEX 2024 focused on “Connecting AI,” showcasing advancements in AI computing, 5G, and smart cars, with notable keynotes from industry leaders like AMD, NVIDIA, Qualcomm, and Intel. Both events highlighted significant technological progress and fostered important industry collaborations.

Please note that the above list of news and announcements is not exhaustive as there were many such similar news related to the launch of new innovative products, advancements to earlier versions and others.

About WAWT

Wired and Wireless Technology (WAWT)™ is the leading and most trustworthy strategic technology analyst and consulting firm focusing on the wireless power and power supply industry. No one covers these segments as WAWT does, with our subject matter expert attending around 15 key industry events and trade shows across the year and across regions, to get hold of the latest trends, news and announcements to deliver market insights and intelligence to our esteemed customers and industry associates.

WAWT published comprehensive research and reports on the global power supply industry, titled “AC-DC and DC-DC Merchant Power Supply Market Report” and “External Power Adapters and Chargers Market Report”, offering critical market data, trends, insights and market intelligence. WAWT‘s report is an invaluable resource for businesses seeking to understand the power supply market landscape, make informed decisions, and stay competitive in this dynamic industry.

Feel free to reach out to our subject matter experts (SMEs) by emailing analyst@wawt.tech and following our LinkedIn page (WAWT) for the latest market trends, insights and updates on power supplies and allied technologies.