As a leading technology analyst and strategic consulting firm closely monitoring the pulse of power supplies, wireless power, semiconductors, EV charging and the broader energy ecosystem, our subject matter expert (SME), Dinesh Kithany visited PCIM Europe 2025 revealed a vibrant convergence of technologies driving electrification, efficiency, and AI-powered innovation.

PCIM Europe 2025 Overview

PCIM Europe 2025 held from May 6^th – 8^th in Nuremberg, Germany reaffirmed its reputation as the leading international exhibition and conference for power electronics, this time focusing on AI Datacentres, vehicle electrification, intelligent motion, renewable energy, and energy management. With 685 exhibitors from 31 countries and around 16,500 visitors, the event marked record participation. Notably, 62% of exhibitors came from outside Germany, reinforcing PCIM’s global stature.

The conference segments were equally robust, hosting 433 presentations and attracting 818 delegates from 26 countries. Discussions spanned the latest technological advancements, research breakthroughs, and market trends.

Key Highlights from PCIM Europe 2025

Smaller, Faster, Greener: The Rise of GaN

PCIM 2025 featured a strong focus on Gallium Nitride (GaN), especially for applications requiring speed, compactness, and higher power density. Key players (to name a few) like Infineon, Navitas, ROHM, EPC (Efficient Power Conversion), Cambridge Gan Devices (CGD), Toshiba Semiconductor, and few others highlighted new GaN-based power devices geared for AI, EVs, mobile charging, as well as other applications of power supplies like in datacentres, medical, industrial, lighting sectors. Other discussions and demonstrations of GaN based solutions, aside of its comparison with SiC, were related to vertical GaN, bi-directional approach, as well as looking at wider adoption of GaN beyond charging of consumers (mobile devise) and AI datacentres.

High-Frequency GaN-Based Resonant Gate Driver for SiC MOSFETs

Innovative gate driver designs were seen to be considering GaN-based solutions as they are expected to efficiently drive SiC power switches. It enables higher frequency operations with reduced EMI and better thermal performance.

Next Generation 4 SiC Technology

While GaN was showing popularity, interest and gaining maturity as a technology, PCIM 2025 continues to witness advancement in the SiC-based solutions. Example, Wolfspeed’s Generation 4 SiC technology was emphasizing on better efficiency, scalability, and cost-performance balance aimed at the future of e-mobility and renewable grids.

The discussion across most of the booths and keynote presentations also questioned and debated on SiC vs GaN across parameters and applications, as well as costs. While costs of GaN is seen to be dropping faster to more realistic and commercial-adaptable levels, that of SiC is also expected to decline, thus the gap not reducing faster as one would expect.

Improvements in Integrated GaN Power Devices (Light-Load Performance)

New GaN ICs optimized for light-load conditions, improving standby efficiency. Enhanced control and integration reduce energy waste in low-power modes.

Future of AI with Scalable Energy Solutions

At PCIM Europe 2025 in Nuremberg, WAWT had the opportunity to engage with industry leaders shaping the future of power electronics – monitoring the innovations that are driving the entire AI infrastructure from the electrical grid to the processor core. The rise of artificial intelligence has placed immense demands on datacenters, driving unprecedented growth in power requirements across all layers of system architecture. Industry seems to be challenged with regards to development of appropriate power solutions catering to the (fast) growing needs of the AI Datacentres markets, not only from the desired specification point of view, but also looking at efficiency and sustainability of such high-power power solutions.

AI Data Centers Surging Beyond 1 Megawatt per Rack

As Artificial Intelligence (AI) workloads and applications spread widely across sectors, and intensify, datacenters are undergoing a transformative shift, that too at a rapid space. AI training environments now cluster hundreds or even thousands of GPUs into virtual machines. This leads to a sharp increase in rack-level power consumption, with projections indicating a move to 600 kilowatts per rack within two years, which is four times current levels, and to more than 1 megawatt per rack in the next three to four years. These trends necessitate rethinking traditional power delivery systems. One starts to consider innovative and appropriate cooling technologies (air, liquid, immersion, chip), use of nuclear energy, underwater/undersea datacentres, etc.

Vertical Power Delivery: Meeting 10,000A Current Demands

Another key trend was the need for vertical power delivery to meet the demands of next-gen GPUs and AI processors. As GPUs increase in physical size and move to lower supply voltages down to 0.4V power requirements soar to new heights. Current levels are expected to reach up to 10,000 amperes per GPU by the end of the decade. Traditional lateral power distribution becomes ineffective under such conditions. The solution lies in vertical power delivery bringing power directly to the back of the chip for ultra-efficient energy transfer.

Growing development and adoption of half-bridge ICs

PCIM Europe 2025 witnessed increase in discussion and introduction, by companies such as Infineon, Power Integrations (PI), EPC, Navitas Semiconductors and Melexis, of half-bridge ICs with embedded sensing which provides a more efficient and cost-effective solution for precision motor control, particularly in applications like brushless DC (BLDC) motors. These half-bridge ICs integrate power stages, drivers, and sensing functions on a single chip, thereby improving efficiencies, increasing precision and control, reducing component count and PCB area, leading to costs reduction and increasing reliability. This process also reduces the development time.

Advancements in Lithium Battery Tech

As reliance on batteries across sectors, automotive as well as other key sectors, there was lots of emphasis on the various types of batteries and advancement on its technology. For example, the recent breakthrough at Integrals Power Ltd., focusing on higher-density Li-ion cells tailored for e-mobility and grid applications, driving performance and affordability.

Smart Automotive Switches

Onsemi launched smart switching modules designed to replace traditional fuses in vehicles offering better diagnostics, safety, and power optimization in modern automotive platforms.

Top News

• Infineon’s CoolSiC™ JFET Technology: Infineon showcased normally-on JFETs delivering low conduction losses ideal for industrial and automotive inverters.
• Navitas Semiconductors’s GaNSense™ Motor Drivers: Introduced Half-Bridge ICs with embedded sensing for precision motor control (for BLDC, brushless motors) and reduced system cost.
• EPC’s Advanced GaN Transistors for Power Conversion: Demonstrated next-gen eGaN® FETs enabling ultra-efficient, compact converters for AI, robotics, and automotive applications.
• ROHM’s EcoGaN™ for AI Server Power Supplies: ROHM launched high-speed switching devices optimized for 48V AI server and datacenter power architectures. Murata Power selects ROHM’s EcoGaN for AI servers.
• Pulsiv’s fully assembled low-temperature USB-C modules: Pulsivrevealed ultra-efficient USB-C reference designs that operate at lower temperatures, reducing thermal stress in adapters.
• Wolfspeed’s SiC-based embedded power solutions: Wolfspeed demonstrated rugged MOSFETs and gate drivers optimized for harsh environments in EV and industrial systems.
• Murata’s FTI Series for High-Temperature Applications: Murata unveiled compact, high-reliability film capacitors suitable for 125°C+ environments in EVs and industrial drives. Similar solutions were also showcased by TDK, Vishay and other players.
• ROHM’s new TRCDRIVE Pack™ for E-Mobility: ROHM debuted power modules integrating SiC devices and optimized cooling for compact, high-power EV traction systems.
• Renesas Electronics’ New Super Junction MOSFETs: Engineered for high efficiency and reduced conduction losses, these MOSFETs from Renesas Electronics feature optimized charge balance and an integrated fast-recovery diode for improved performance in advanced power applications.
• Farnell, ST Micro, Nexperia, Vishay were amongst those who introduced the 6th-Generation Ultrafast Recovery Diodes: Delivering enhanced switching performance and superior thermal management, these diodes are ideal for next-generation power electronics, particularly in high-efficiency rectifier designs.
• Wolfspeed introduced the next-Generation Power Modules (Including Silicon Carbide): Wolfspeed developed for automotive and renewable energy applications, these modules feature advanced packaging formats such as Tesla, TSP, and TSPM, enabling high power density and reliability.
• WeEn Semiconductors unveiled the new 2000V High-Voltage Rectifier: WeEn’s new 2000V high-voltage rectifier offers over 20% reduction in internal resistance, significantly boosting efficiency and cooling performance. Designed for demanding applications like EV chargers and solar inverters.

• There was limited presence of wireless power technology solutions at PCIM Europe 2025.
  • EPC for first time showcased its NFC Wireless Charging-based Smart Ring application based on high-frequency magnetic resonance (6,78MHz)-based  solution.
  • Wurth Electronics showcased its wide range of wireless power solutions, coil technology and designs catering to different power classes, applications as well as form-factors.
  • Magway Materials also witnessed various coil solutions and designs.

• Visual highlights of market trend and insights based on PCIM Europe 2025 can be seenclicking this link.

Conclusion & Footnote

WAWT (Wired & Wireless Technologies) has endeavoured to capture as much latest news, trends, and insights on the power supply and wireless power technology market through its full presence and a lot of meetings with companies across the ecosystem at the PCIM Europe 2025 and by engaging with industry associates before and after this key event. Similarly, WAWT covers around 15 trade shows, industry events and conferences, attending in-person,  across the year to provide authentic and reliable market data, insights, and intelligence to companies across the ecosystem. No one covers the market extensively and in as much detail as WAWT.

Please note that the above-listed news and trend items are not a complete and not an exhaustive list but represent the profile of news and announcements from PCIM Europe 2025. Additionally, the news items listed above are not presented in any specific order or hierarchy order. WAWT would like to take this opportunity to give due credit and thank the participating publications and external sources for their help in compiling this comprehensive list of news and insights related to PCIM Europe 2025.

We would appreciate your feedback on the above insight report from WAWT covering PCIM Europe 2025. More details related to such news, trends, and insights and their impact on the total wireless power and power supply market size are covered in WAWT’s subscription-based research solutions, “Power Supply Intelligence Service” and “Wireless Power Intelligence Service.”

Our next updated comprehensive report, Global AC-DC and DC-DC Merchant Power Supply Report is scheduled to be published end July 2025, and WAWT’s “Wireless Power Intelligence Service,” is scheduled to be published end June 2025. So please be free to get in touch if you want to grab the most reliable market insights on the power supply and wireless power market.